How much value does DAC really add to the industry? Large EDA companies may be ignoring some of the benefits.

Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

Plan for multiple complementary verification methodologies for different levels of processor integration. With the explosive adoption of RISC-V processors, processor verification has become a hot ...

Problems and some solutions for improving performance with more data. Demand for new and better AI models is creating an ...

In the past, simulation was the only tool available for verification, but today there are many. Balancing the costs and ...

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...

As AI applications rapidly advance, AI models are being tasked with processing massive amounts of data containing billions – or even trillions – of parameters. Each large workload involves numerous ...

Pros and cons of replacing copper with optical in data-intensive AI systems.

Post-route signal integrity for PCBs; memory expansion and sharing; interconnects for AI clusters; LPCAMM2; MEMS ...

Use the most advanced AI technology to optimize an entire SoC within a single platform with a small design team.

China's 3nm chip; state of the industry supply chain; imec's next big push; hyper-dimensional AI chip; OpenAI's $6.5B startup ...

News and insights from imec ITF World 2025.